sec manufactures manual and semiautomatic assembly, rework, handling and test equipment used in development and production of microelectronic devices for the semiconductor, hybrid and printed circuit industries. equipment ranges from flip chip die bonders, die handling equipment, rework systems, test equipment, pick and place systems, wafer and die tape to mounting equipment.
Mga keyword sa paghahanap:
semiconductor equipment, flip chip, die bonder,semiautomatic assembly, microelectronic, handling, flip chip, surface mount rework, multichip modules, eutectic die bonder, pick and place, backlap tape applicator, wafer fracturer, bga, wafer dicing tape, blue tape, flip chip, epoxy dispenser, die expander, assembly equipment, silicon wafer, wafer dicing tape, uv tape, temporary adhesives, water soluble adhesives, multifunctional bond tester, semicorp.com
Company Address :
5154 Goldman Ave,MOORPARK,CA,USA
ZIP Code : Postal Code :
93021-1798
Numero ng Telepono :
8055292193 (+1-805-529-2193)
Numero ng Fax:
8055292293 (+1-805-529-2293)
website:
www. semicorp. com
email:
USA tama Code ( Standard Industrial Classification Code ) :
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